共 50 条
- [31] Advanced build-up wiring technology for MCM-D/L 1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 243 - 248
- [32] A build-up substrate utilizing a new via fill technology by electroplating 4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 280 - 288
- [33] Using a new photoimageable dielectric for PWB Sequential Build-Up technology PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 33 - 41
- [37] Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbps optical transmitter and receiver modules 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 847 - 851
- [38] Embedded TiNxOy thin-film resistors in a build-up CSP for 10 gbps optical transmitter and receiver modules IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03): : 448 - 453
- [40] A Comprehensive Study on Signal Integrity of Build-up Film Applied to IC Substrate 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,