DEVICE DESIGN AND LEAD FRAME LAYOUT TECHNIQUES FOR AUTOMATIC WIRE BONDING.

Performance factors that are positively influenced by the use of automatic wire bonders are: a high degree of device quality and reliability, maximum machine utilization and maximum productivity level. Critical to all of these factors are the device layout and package design, which contribute to the level of success of the automatic wire bonder operation. Coupled with some simple device layout rules and lead frame designs, use of a high speed automatic bonder can result in a highly productive and reliable manufacturing process.