TEMPERATURE PREDICTION ON SUBSTRATES AND INTEGRATED CIRCUIT CHIPS.

被引：0
|
作者：
Pinto, E.J. [1 ]
Mikic, B.B. [1 ]
机构：
[1] MIT, Cambridge, MA, USA, MIT, Cambridge, MA, USA
来源：
Heat Transfer Engineering | 1988年 / 9卷 / 03期
关键词：
Compendex;
D O I：
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学科分类号：
摘要：
HEAT TRANSFER - Mathematical Models - TEMPERATURE DISTRIBUTION
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页码：54 / 65
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