Influence of surface mount lead end geometry on fatigue life

被引：0
|
作者：
Gupta, Vineet K. [1 ]
Barker, Donald B. [1 ]
机构：
[1] Univ of Maryland, College Park, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1994年 / 116卷 / 02期
关键词：
Soldered joints;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
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页码：157 / 160
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