Nonlinear analysis of full-matrix and perimeter plastic ball grid array solder joints

被引:0
|
作者
Ford Motor Co, Dearborn, United States [1 ]
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
下载
收藏
页码:163 / 170
相关论文
共 50 条
  • [21] Crack area analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies
    Dept. Mechanical Engineering, University of Texas at Austin, Austin, TX 78712, United States
    不详
    不详
    Electronic and Photonic Packaging Division, ASME, 1600, 701-708 (2003):
  • [22] Monitoring ball grid array solder joints 24 x 7
    Hofmeister, James P.
    Judkins, Justin B.
    Goodman, Douglas
    Tracy, Terry A.
    Roth, Norman N.
    IEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE, 2008, 23 (06) : 31 - 38
  • [23] Crack area analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies
    Park, C
    Filho, JMD
    Kim, D
    Mawer, A
    Masada, GY
    Moon, TJ
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 701 - 708
  • [24] Shearing tests of solder joints on tape ball grid array substrates
    Wu B.Y.
    Zhong H.W.
    Chan Y.C.
    Alam M.O.
    J Mater Res, 2006, 9 (2224-2231): : 2224 - 2231
  • [25] Crack length analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies
    Kim, DY
    Dias, JM
    Park, C
    Mawery, A
    Moon, TJ
    Masada, GY
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1746 - 1753
  • [26] Solder joint reliability of plastic ball grid array with solder bumped flip chip
    Lee, SWP
    Lau, JH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2000, 12 (02) : 16 - 23
  • [27] Modeling and predicting solder joint shapes of plastic ball grid array
    Zhou, Dejian
    Chen, Zichen
    Pan, Kailin
    Wu, Zhaohua
    Zhejiang Daxue Xuebao (Ziran Kexue Ban)/Journal of Zhejiang University (Natural Science Edition), 2000, 34 (06): : 637 - 641
  • [28] Plastic ball grid array solder joint reliability for avionics applications
    Qi, Haiyu
    Osterman, Michael
    Pecht, Michael
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (02): : 242 - 247
  • [29] A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints
    Halouani, Ayda
    Cherouat, Abel
    Chaabane, Mariem Miladi
    Haddar, Mohamed
    2019 20TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2019,
  • [30] Grain growth in eutectic Pb/Sn ball grid array solder joints
    Basaran, C
    Wen, YJ
    ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 903 - 908