Debonding in overmolded integrated circuit packages

被引：0
|
作者：
Hunt, S. [1 ]
Carlsson, L.A. [1 ]
机构：
[1] Motorola Inc, Ft. Lauderdale, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1993年 / 115卷 / 03期
关键词：
13;
D O I：
暂无
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学科分类号：
摘要：
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页码：249 / 255
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