Debonding in overmolded integrated circuit packages

被引：0

作者：

Hunt, S. ^{[1
]}

Carlsson, L.A. ^{[1
]}

机构：

[1] Motorola Inc, Ft. Lauderdale, United States

来源：

Journal of Electronic Packaging, Transactions of the ASME | 1993年 / 115卷 / 03期

关键词：

13;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：249 / 255

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