Determining the thermal expansion coefficient of conductive thin film by thermal bend test

被引：0
|
作者：
Shen, W. [1 ]
Peng, L.H. [1 ]
Li, W. [1 ]
Deng, C.Y. [1 ]
机构：
[1] Dep. of Mechanics, Huazhong Univ. of Sci. and Technol., Wuhan 430074, China
来源：
Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica | 2001年 / 18卷 / 02期
关键词：
Composite materials - Thermal expansion;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The bending problem of the thin film/substrate composite subjected to thermal load is studied. The relation between the thermal expansion coefficient of conductive thin films and the temperature and the relation between the thermal expansion coefficient of conduction thin films and the deformation of specimen surfaces are derived in this paper. Based on the findings, a method for measuring the thermal expansion coefficient of conductive thin films is developed. The thermal expansion coefficient of conductive thin films has been measured by applying the method in a thermal bend test.
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页码：90 / 92
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