Promoting resist adhesion

Chemical microetching, as a resist adhesion process, has many potential benefits, including the production of thin innerlayers with fine tracks and gaps. It offers the possibility to improve yields by eliminating the need to mechanically clean without resorting to exotic copper fuel laminates. In the solder mask process, adhesion achieved on the treated surface is better than obtained by any conventional method. This is particularly beneficial with boards that exhibit problems during hot air solder leveling or nickel-gold plating. Moreover, these benefits do not compromise the reliability of PCB, which is equal or better than any produced using conventional copper conditioning method.