共 50 条
- [41] Ohmic InP/Si Direct Bonding for Multijunction Solar Cell Applications 2019 IEEE 46TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC), 2019, : 998 - 1000
- [42] Fabrication of InP/SiC structure using surface activated direct bonding 2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2021, : 46 - 46
- [46] 1.5 μm GaInAsP Stripe Laser Comparison Between InP Substrate and Directly Bonded InP/Si Substrate 2018 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2018,
- [47] Low temperature lasing characteristics of GaInAsP double-hetero laser integrated on InP/Si substrate using direct wafer bonding 2016 21ST OPTOELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC) HELD JOINTLY WITH 2016 INTERNATIONAL CONFERENCE ON PHOTONICS IN SWITCHING (PS), 2016,
- [48] Direct water bonding of a (001) InP-based strained multiple quantum well on a (110) Si substrate with a GaAs buffer layer, aligning cleavage planes of InP and Si JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1996, 35 (12B): : L1652 - L1654
- [49] Analytical Model for Magnetooptic Five-layered Planar Waveguides 2017 SBMO/IEEE MTT-S INTERNATIONAL MICROWAVE AND OPTOELECTRONICS CONFERENCE (IMOC), 2017,
- [50] Direct writing of optical waveguides on PADC substrate by e-beam APPLICATIONS OF PHOTONIC TECHNOLOGY 4: CLOSING THE GAP BETWEEN THEORY, DEVELOPMENT, AND APPLICATION, 2000, 4087 : 696 - 703