Challenges of flip chip on organic substrate assembly technology

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作者：
Intel Corp, Santa Clara, United States [1 ]
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来源：
Proc Electron Compon Technol Conf | / 975-978期
关键词：
Epoxy resins - Flip chip devices - Melting - Microprocessor chips - Reliability - Silicon wafers - Soldered joints - Substrates - Surface active agents - Surface mount technology;
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摘要：
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel's microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed. The paper discusses the challenges faced, and their resolution during the development of this key technology that is implemented in high volume manufacturing at Intel.
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