Continuous powder coating encapsulation process

被引：0
|
作者：
Hysol Division, Dexter GmbH, Munich, Germany [1 ]
机构：
来源：
EIC - Proc. Electr. Insulation Conf. | / 233-235期
关键词：
Engineering Village;
D O I：
10th Electrical Insulation Conference, EIC 1971
中图分类号：
学科分类号：
摘要：
Coating equipment - Electronic component - Encapsulation methods - Encapsulation process - Fusion temperature - Production techniques
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