Back-to-back BGA routing

被引：0
|
作者：
Voss, Bernard [1 ]
机构：
[1] Consulting Group, SiQual Inc., Tualatin, OR, United States
来源：
Printed Circuit Design | 2003年 / 20卷 / 01期
关键词：
Capacitance - Crosstalk - Dielectric materials - Multilayers - Printed circuit design - Routers - Signal processing - Substrates;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A study was performed on back-to-back BGA routing. The back-to-back BGAs are found to be characteristic of extremely dense circuit designs. The successful back-to-back BGA solution required true interconnect engineering together with a formal approach to printed circuit design that coordinated floor planning and escape routing with global routing at maximum overall density.
引用
收藏
页码：16 / 19
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