Aluminum interconnects for ULSI: The CVD route

被引：0
|
作者：
Univ at Albany-SUNY, Albany, United States [1 ]
机构：
来源：
Semiconductor International | 1996年 / 19卷 / 12期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
10
引用
收藏
相关论文
共 50 条
  • [21] Property improvement of copper films with zirconium additive for ULSI interconnects
    Wang, Ying
    Yang, Xiao-dong
    Song, Zhong-xiao
    Liu, Yun-tao
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 486 (1-2) : 418 - 422
  • [22] Comparative study of novel barrier layers in ULSI copper interconnects
    Wang, Kai
    Horsfall, Alton
    Cuthbertson, Alan
    Bull, Steve
    O'Neill, Anthony
    MICROELECTRONIC ENGINEERING, 2007, 84 (11) : 2486 - 2490
  • [23] MO CVD interconnects for spherical semiconductors
    Murzin, I
    Miller, J
    Tapiawala, A
    Takeda, N
    MICROELECTRONIC ENGINEERING, 2000, 50 (1-4) : 515 - 523
  • [24] Advanced single precursor based pSiCOH k=52.4 for ULSI interconnects
    Priyadarshini, Deepika
    Nguyen, Son V.
    Shobha, Hosadurga
    Liniger, Eric
    Chen, James H. -C.
    Huang, Huai
    Cohen, Stephan A.
    Grill, Alfred
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2017, 35 (02):
  • [25] Aluminum nano interconnects
    Steinlesberger, G
    Schindler, G
    Engelhardt, M
    Steinhögl, W
    Traving, M
    PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 51 - 53
  • [26] From tribological coatings to low-k dielectrics for ULSI interconnects
    Grill, A
    THIN SOLID FILMS, 2001, 398 : 527 - 532
  • [27] Characteristics of fractal dipole antennas integrated on Si for ULSI wireless interconnects
    Kimoto, K
    Watanabe, S
    Kikkawa, T
    Hall, PS
    Yuan, Y
    IEEE ANTENNAS AND PROPAGATION SOCIETY SYMPOSIUM, VOLS 1-4 2004, DIGEST, 2004, : 3437 - 3440
  • [28] Growth of conformal copper films on TaN by electrochemical deposition for ULSI interconnects
    Kim, Sunjung
    Duquette, David J.
    SURFACE & COATINGS TECHNOLOGY, 2006, 201 (06): : 2712 - 2716
  • [29] Electro-chemical deposition technology for ULSI multilevel copper interconnects
    Ting, Chiu H.
    Papapanayiotou, Demetrius
    Zhu, Mei
    International Conference on Solid-State and Integrated Circuit Technology Proceedings, 1998, : 198 - 201
  • [30] PLASMA-ETCHING OF ALUMINUM FOR ULSI CIRCUITS
    RILEY, PE
    PENG, SS
    FANG, L
    SOLID STATE TECHNOLOGY, 1993, 36 (02) : 47 - &
12345