Relationship between copper concentration and stress during electromigration in an Al(0.25 at.% Cu) conductor line

被引：0
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作者：
Kao, H.-K. [1 ,3 ]
Cargill III, G.S. [1 ]
Giuliani, F. [1 ,4 ]
Hu, C.-K. [2 ]
机构：
[1] Dept. of Mat. Sci. and Engineering, Lehigh University, Bethlehem, PA 18015, United States
[2] IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598, United States
[3] Intel Corp., Santa Clara, CA 95052, United States
[4] Dept. of Mat. Sci. and Metallurgy, University of Cambridge, Pembroke Street, Cambridge CB2 3QZ, United Kingdom
来源：
Journal of Applied Physics | 2003年 / 93卷 / 05期
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页码：2516 / 2527
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