Tin-lead plating on encapsulated semiconductor lead frames

被引：0

作者：

机构：

[1] Foppen, Robert

来源：

Foppen, Robert | 1600年 / 91期

关键词：

Cut strips - Encapsulated semiconductor lead frames - Hot dip - Solder plating - Tin-lead plating;

D O I：

暂无

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学科分类号：

摘要：

引用

共 50 条

[31] Pre-plated palladium lead frames vs spot selective silver and tin-lead
Burling, S
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1998, 76 : 23 - 25
[32] Pre-plated palladium lead frames vs spot selective silver and tin-lead
Burling, S.
Transactions of the Institute of Metal Finishing, 1998, 76 (pt 2): : 23 - 25
[33] ON THE PASSIVATION OF TIN-LEAD ALLOYS
GOBAL, F
INDIAN JOURNAL OF CHEMISTRY SECTION A-INORGANIC BIO-INORGANIC PHYSICAL THEORETICAL & ANALYTICAL CHEMISTRY, 1987, 26 (05): : 424 - 426
[34] ELECTRODEPOSITION OF A TIN-LEAD ALLOY
KUDRYAVTSEV, NT
TYUTINA, KM
GAVRILIN, ON
SELIVANOVA, GA
CHERNYKH, IV
PROTECTION OF METALS, 1978, 14 (01): : 31 - 32
[35] TIN-LEAD RATIO DETERMINATION
不详
METAL FINISHING, 1985, 83 (02) : 100 - 100
[36] Current technologies for plating lead frames - a comparison of pre-plated lead frames versus spot selective silver and tin lead
Burling, SA
Stafford, P
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1999, 77 : B61 - B65
[37] Current technologies for plating lead frames - a comparison of pre-plated lead frames versus spot selective silver and tin lead
Burling, S.A.
Stafford, P.
Transactions of the Institute of Metal Finishing, 1999, 77 (04):
[38] THE SUPPRESSION OF TIN, LEAD AND TIN-LEAD ELECTRODEPOSITION BY ORGANIC-COMPOUNDS
GOODENOUGH, M
WHITLAW, KJ
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1989, 67 : 44 - 48
[39] DIFFERENTIAL PULSE POLAROGRAPHY OF ORGANIC ADDITIVES IN ACID TIN AND BRIGHT TIN-LEAD PLATING BATHS
SUMMERS, RL
PLATING AND SURFACE FINISHING, 1983, 70 (05): : 20 - 20
[40] SOLDERING OF ELECTROLYTIC TIN AND TIN-LEAD COATINGS
不详
MECHANIK MIESIECZNIK NAUKOWO-TECHNICZNY, 1974, 47 (10): : 600 - 600

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