DfE study gives alternative finishes the green light

被引：0

作者：

Hart, Kathy ^{[1
]}

Singh, Dipti ^{[2
]}

Geibig, Jack ^{[3
]}

Swanson, Mary ^{[3
]}

Abrams, Fern ^{[4
]}

机构：

[1] U.S. EPA Des. for Environ. Program, Washington, DC, United States

[2] U.S. EPA DfE Program

[3] University of Tennessee, Ctr. for Clean Prod./Clean Technol.

[4] IPC, Washington, DC, United States

来源：

Printed Circuit Fabrication | 2000年 / 23卷 / 10期

关键词：

Cost benefit analysis - Cost effectiveness - Environmental protection - Finishing - Health risks - Performance - Printed circuit manufacture - Quality control - Technology transfer;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The Design for Environment Printed Wiring Board (DfE PWB) Project evaluated lead-free technologies that may be used during surface finishing, in place of hot air solder leveling (HASL), to identify those surface finish technology alternatives that perform competitively, are cost-effective, and pose fewer potential and environmental and health risks. Significant data were collected from the suppliers and through the Workplace Practices Survey.

引用

页码：32 / 34

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