DfE study gives alternative finishes the green light

被引：0
|
作者：
Hart, Kathy [1 ]
Singh, Dipti [2 ]
Geibig, Jack [3 ]
Swanson, Mary [3 ]
Abrams, Fern [4 ]
机构：
[1] U.S. EPA Des. for Environ. Program, Washington, DC, United States
[2] U.S. EPA DfE Program
[3] University of Tennessee, Ctr. for Clean Prod./Clean Technol.
[4] IPC, Washington, DC, United States
来源：
Printed Circuit Fabrication | 2000年 / 23卷 / 10期
关键词：
Cost benefit analysis - Cost effectiveness - Environmental protection - Finishing - Health risks - Performance - Printed circuit manufacture - Quality control - Technology transfer;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The Design for Environment Printed Wiring Board (DfE PWB) Project evaluated lead-free technologies that may be used during surface finishing, in place of hot air solder leveling (HASL), to identify those surface finish technology alternatives that perform competitively, are cost-effective, and pose fewer potential and environmental and health risks. Significant data were collected from the suppliers and through the Workplace Practices Survey.
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页码：32 / 34
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