Tack-free flexible film adhesives

被引：0
|
作者：
机构：
[1] Chung, Kevin K.T.
[2] Dreier, Garry
[3] Avery, Eldon
[4] Boyle, Andrew
[5] Koehn, William
[6] Govaert, Guido
[7] Theunissen, Dirk
来源：
Chung, Kevin K.T. | 1990年 / 07期
关键词：
Adhesives - Integrated Circuits; Hybrid - Integrated Circuits; Thin Film - Microelectronics;
D O I：
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中图分类号：
学科分类号：
摘要：
In the past, the use of film adhesives in microelectronics has been somewhat restricted to substrate applications in hybrid devices. There are some distinct advantages in using this form of adhesive as opposed to the conventional paste format. A new series of film adhesives has been developed that are dry to the touch and thus extremely adaptable to a more automated assembly process. In this article, some of the applications and details of this technology are discussed.
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