Computer aided design of a layout of planar circuits by means of evolutionary algorithms

被引:0
|
作者
Arabas, Jaroslaw [1 ]
Miazga, Przemyslaw [1 ]
机构
[1] Faculty of Electronics and information Technology, Warsaw University of Technology, ul. Nowowiejska 15/19, Warszawa,00-665, Poland
来源
Journal of Computing and Information Technology | 1999年 / 7卷 / 01期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:61 / 76
相关论文
共 50 条
  • [21] Computer-Aided Design of Microfluidic Circuits
    Tsur, Elishai Ezra
    ANNUAL REVIEW OF BIOMEDICAL ENGINEERING, VOL 22, 2020, 22 : 285 - 307
  • [22] Computer-aided design of RF circuits
    Mittra, R
    Veremey, V
    IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, VOLS 1-4: TRANSMITTING WAVES OF PROGRESS TO THE NEXT MILLENNIUM, 2000, : 596 - 599
  • [23] COMPUTER-AIDED-DESIGN FOR VLSI CIRCUITS
    NEWTON, AR
    SANGIOVANNIVINCENTELLI, AL
    COMPUTER, 1986, 19 (04) : 38 - 60
  • [24] Computer aided design (CAD) for printed circuits
    Ferrari, G.
    Circuit World, 1993, 20 (01) : 25 - 28
  • [25] COMPUTER-AIDED-DESIGN OF HYBRID CIRCUITS
    FERRARIS, GP
    CAGNIN, T
    FRANCESE, F
    PIANA, L
    ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1983, 10 (04): : 199 - 208
  • [26] COMPUTER-AIDED-DESIGN OF VLSI CIRCUITS
    NEWTON, AR
    PROCEEDINGS OF THE IEEE, 1981, 69 (10) : 1189 - 1199
  • [27] COMPUTER-AIDED-DESIGN FOR PLANAR MICROSTRIP CIRCUITS ANALYSIS BY BOUNDARY-INTEGRAL METHOD
    CHANG, SS
    HUANG, WX
    ITOH, T
    19TH EUROPEAN MICROWAVE CONFERENCE : MICROWAVE 89, 1989, : 975 - 978
  • [28] Computer aided design of a planar phased array
    Karmakar, NC
    Bialkowski, ME
    2000 IEEE INTERNATIONAL CONFERENCE ON PHASED ARRAY SYSTEMS AND TECHNOLOGY, PROCEEDINGS, 2000, : 481 - 484
  • [29] Aesthetics considerations in evolutionary computer aided design
    Case, K
    Kari, MSA
    APPLICATIONS OF DIGITAL TECHNIQUES IN INDUSTRIAL DESIGN ENGINEERING-CAID&CD' 2005, 2005, : 476 - 481
  • [30] WIRING ALGORITHMS FOR COMPUTER-AIDED LAYOUT OF MULTILAYER HYBRID MICROCIRCUITS
    PRICE, IR
    MORAN, P
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (02): : 143 - 146