INSPECTION SYSTEM FOR PARTICULATE AND DEFECT DETECTION ON PRODUCT WAFERS.

被引：0
|
作者：
Anon
机构：
来源：
IBM technical disclosure bulletin | 1985年 / 27卷 / 12期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：6971 / 6973
相关论文
共 50 条
  • [21] SCANNING PHOTON MICROSCOPE FOR NON-DESTRUCTIVE OBSERVATIONS OF CRYSTAL DEFECT AND INTERFACE TRAP DISTRIBUTIONS IN SILICON WAFERS.
    Kinameri, K.
    Munakata, C.
    Mayama, K.
    1600, (21):
  • [22] Verification of the system of defect inspection on patterned wafers using sub-200 nm wavelength light
    Takahashi, Tetsuo
    Miyazakia, Yoko
    Tanaka, Toshihiko
    Terasawa, Tsuneo
    Takeuchi, Naoya
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XX, PTS 1 AND 2, 2006, 6152
  • [23] Detection and classification of defect patterns on semiconductor wafers
    Wang, Chih-Hsuan
    Kuo, Way
    Bensmail, Halima
    IIE TRANSACTIONS, 2006, 38 (12) : 1059 - 1068
  • [24] Fast and reliable WLR monitoring methodology for assessing thick dielectrics test structures integrated in the kerf of product wafers.
    Martin, A
    von Hagen, J
    Fazekas, J
    Allers, KH
    2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT, 2002, : 83 - 87
  • [25] Detection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
    Meli, Luciana
    Bonam, Ravi
    Halle, Scott
    Felix, Nelson
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2017, 30 (04) : 402 - 409
  • [26] Detection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
    Melia, Luciana
    Halle, Scott D.
    Bonam, Ravi
    Felix, Nelson
    Vemareddy, Kaushik
    2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2016, : 72 - 77
  • [27] Optical inspection system with tunable exposure unit for micro-crack detection in solar wafers
    Ko, Shun-Sheng
    Liu, Chien-Sheng
    Lin, Yang-Cheng
    OPTIK, 2013, 124 (19): : 4030 - 4035
  • [28] E-beam Inspection of EUV Programmed Defect Wafers for Printability Analysis
    Bonam, Ravi
    Halle, Scott
    Corliss, Daniel
    Tien, Hung-Yu
    Wang, Fei
    Fang, Wei
    Jau, Jack
    2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2013, : 310 - 314
  • [29] A Study on the Effect of Inspection Time on Defect Detection in Visual Inspection
    Nakajima, Ryosuke
    Shida, Keisuke
    Matsumoto, Toshiyuki
    ADVANCES IN PRODUCTION MANAGEMENT SYSTEMS: SUSTAINABLE PRODUCTION AND SERVICE SUPPLY CHAINS, PT 1, 2013, 414 : 29 - 39
  • [30] Defect detection in patterned wafers using anisotropic kernels
    Maria Zontak
    Israel Cohen
    Machine Vision and Applications, 2010, 21 : 129 - 141
12345