ULTRASONIC BALL/WEDGE BONDING OF ALUMINIUM WIRES.

被引：0
|
作者：
Dawes, C.J.
Johnson, K.I.
Scott, M.H.
机构：
来源：
Electrocomponent Science and Technology | 1979年 / 7卷 / 1-3期
关键词：
INTEGRATED CIRCUIT MANUFACTURE - Bonding;
D O I：
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中图分类号：
学科分类号：
摘要：
The process of ball/wedge bonding and its advantages are described. A capacitor discharge technique for the formation of balls on 25 and 75 mu m diameter aluminum wires is discussed. Ultrasonic welding trials were carried out and the bonds subjected to pull tests with good results. Bonds of good strength were made between 25 mu m diameter Al-1% Si wire and Al thin films, Pd-Au thick films and Au flashed Kovar.
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页码：119 / 124
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