Diffusion bonding mechanism of submicron composite Al2O3p/6061Al

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作者：

Niu, Jitai

Liu, Liming

Wu, Gaohui

Zhai, Jinfan

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Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | / 9卷 / 03期

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页码：477 / 481

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