共 50 条
- [21] Structured abrasive CMP: Length scales, subpads, and planarization CHEMICAL-MECHANICAL POLISHING - FUNDAMENTALS AND CHALLENGES, 2000, 566 : 51 - 62
- [23] Structured abrasive CMP: length scales, subpads, and planarization Materials Research Society Symposium - Proceedings, 2000, 566 : 51 - 62
- [25] An integrated characterization and modeling methodology for CMP dielectric planarization PROCEEDINGS OF THE IEEE 1998 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 1998, : 67 - 69
- [29] Effect of abrasive in Cu-CMP slurry on global planarization ADVANCES IN CHEMICAL-MECHANICAL POLISHING, 2004, 816 : 107 - 111
- [30] Scratch formation and its mechanism in chemical mechanical planarization (CMP) Friction, 2013, 1 : 279 - 305