共 50 条
- [41] ELECTRODEPOSITION OF COPPER-TIN ALLOYS FROM FLUOBORATE BATH JOURNAL OF SCIENTIFIC & INDUSTRIAL RESEARCH, 1962, D 21 (11): : 414 - &
- [42] DEVIATIONS FROM MATTHIESSENS RULE IN ALUMINUM, TIN, AND COPPER ALLOYS PHYSICAL REVIEW, 1959, 116 (02): : 334 - 338
- [44] Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper Journal of Materials Science: Materials in Electronics, 2011, 22 : 1685 - 1693
- [46] SURFACE-TENSION OF LEAD AND ITS SILVER, TIN AND COPPER-ALLOYS TRANSACTIONS OF THE INSTITUTION OF MINING AND METALLURGY SECTION C-MINERAL PROCESSING AND EXTRACTIVE METALLURGY, 1991, 100 : C165 - C169
- [47] DISCUSSION OF ACTIVITIES OF OXYGEN IN LIQUID COPPER AND ITS ALLOYS WITH SILVER AND TIN - REPLY METALLURGICAL TRANSACTIONS, 1970, 1 (04): : 1038 - &
- [49] The equilibrium diagram of copper-tin alloys containing from 10 to 25 atomic per cent of tin. JOURNAL OF THE INSTITUTE OF METALS, 1927, 38 : 217 - U53
- [50] SOME FACTORS AFFECTING THE DIMENSIONAL STABILITY OF THE SILVER-TIN-(COPPER-ZINC) AMALGAMS JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS, 1954, 52 (04): : 185 - 193