AFFECTING FACTORS AND REPRESSIONS OF TIN WHISKER GROWING FROM TIN-PLATED COPPER AND ITS ALLOYS.

被引：0
|
作者：
Shiga, S.
Suzuki, S.
Kato, H.
Naruse, T.
机构：
来源：
Furukawa Denko Jiho/ Furukawa Electric Review | 1981年 / 73期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
COPPER PLATING
引用
收藏
页码：165 / 175
相关论文
共 50 条
  • [1] Tin-plated Copper Alloys for Replacing Gold-plated Terminals
    Ueda, Yutaro
    Tsuru, Masahiro
    Mitsui, Toshiyuki
    R and D: Research and Development Kobe Steel Engineering Reports, 2024, 73 (02): : 140 - 145
  • [2] FRETTING CORROSION OF TIN-PLATED COPPER ALLOY
    LEE, A
    MAMRICK, MS
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (01): : 63 - 67
  • [3] TRANSPORT OF MERCURY ALONG TIN-PLATED COPPER WIRES
    OGSTON, WM
    JOURNAL OF THE INSTITUTE OF METALS, 1972, 100 (DEC): : 384 - 384
  • [4] Accelerated testing of tin-plated copper alloy contacts
    Malucci, RD
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (01): : 53 - 60
  • [5] Accelerated testing of tin-plated copper alloy contacts
    IEEE
    不详
    IEEE Trans. Compon. Packag. Technol., 1 (53-60):
  • [6] FRETTING CORROSION OF TIN-PLATED COPPER ALLOY.
    Lee, Anthony
    Mamrick, Michael S.
    IEEE transactions on components, hybrids, and manufacturing technology, 1986, CHMT-10 (01): : 63 - 67
  • [7] FRETTING DAMAGE IN TIN-PLATED ALUMINUM AND COPPER CONNECTORS
    BRAUNOVIC, M
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (02): : 215 - 223
  • [8] The corrosion of tin and its alloys. Part I. The tin-rich tin-antimony-copper alloys.
    Hoar, TP
    JOURNAL OF THE INSTITUTE OF METALS, 1934, 55 : 135 - 146
  • [9] COMPARISON OF THE ADHESIVE STRENGTH OF A BIS-GMA CEMENT TO TIN-PLATED AND NON-TIN-PLATED ALLOYS
    GATES, WD
    DIAZARNOLD, AM
    AQUILINO, SA
    RYTHER, JS
    JOURNAL OF PROSTHETIC DENTISTRY, 1993, 69 (01): : 12 - 16
  • [10] Effect of intermetallic phases on the performance of tin-plated copper connections and conductors
    Braunovic, M
    PROCEEDINGS OF THE FORTY-NINTH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS, 2003, : 124 - 131
12345