TRENDS IN BONDING SYSTEMS.

被引：0
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作者：
Takagi, Motoki
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来源：
JEE, Journal of Electronic Engineering | 1982年 / 192期
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摘要：
As automation expands to cope with the surge in demand for semiconductor devices, and to improve productivity and enhance product quality, other equipment builders are working to produce fast and accurate bonders by improving mechanical components and adopting pattern-recognition systems to raise the functions of bonders to meet the needs of semiconductor producers.
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页码：68 / 72
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