Bond strength of bonded SOI wafers

被引:0
|
作者
机构
[1] Sugimoto, Fumitoshi
[2] Arimoto, Yoshihiro
来源
Sugimoto, Fumitoshi | 1600年 / 31期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Analysis of in situ bond strength of bonded concrete overlay
    Rith, Makara
    Kim, Young Kyu
    Lee, Seung Woo
    Park, Jun Young
    Han, Seung Hwan
    CONSTRUCTION AND BUILDING MATERIALS, 2016, 111 : 111 - 118
  • [32] SHEAR BOND STRENGTH OF BRACKETS BONDED WITH GLASS IONOMERS
    SCOTT, GG
    GARCIAGODOY, F
    SUMMITT, JB
    JOURNAL OF DENTAL RESEARCH, 1995, 74 : 187 - 187
  • [33] Analytical solution for the bond strength of externally bonded reinforcement
    Wu, Yu-Fei
    Xu, Xin-Sheng
    Sun, Jia-Bin
    Jiang, Cheng
    COMPOSITE STRUCTURES, 2012, 94 (11) : 3232 - 3239
  • [34] A comparison of shear bond strength of brackets bonded to zirconia
    Knott, Hannah
    Xu, Xiaoming
    Kee, Edwin
    Yu, Qingzhao
    Armbruster, Paul
    Ballard, Richard
    AUSTRALASIAN ORTHODONTIC JOURNAL, 2021, 37 (01): : 62 - 68
  • [35] THE TENSILE BOND STRENGTH OF RESIN-BONDED CERAMICS
    SUKJARUWAN, S
    VANNOORT, R
    JOURNAL OF DENTAL RESEARCH, 1995, 74 : 431 - 431
  • [36] Contribution of polished surface waviness to final SOI thickness uniformity of bonded wafers through PACE process
    Mitani, K
    Nakano, M
    Abe, T
    IEICE TRANSACTIONS ON ELECTRONICS, 1997, E80C (03) : 370 - 377
  • [37] Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests
    K. N. Chen
    S. M. Chang
    L. C. Shen
    R. Reif
    Journal of Electronic Materials, 2006, 35 : 1082 - 1086
  • [38] Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests
    Chen, K. N.
    Chang, S. M.
    Shen, L. C.
    Reif, R.
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) : 1082 - 1086
  • [39] SOI wafers based on epitaxial technology
    Sakaguchi, K
    Yonehara, T
    SOLID STATE TECHNOLOGY, 2000, 43 (06) : 88 - +
  • [40] MEMS on cavity-SOI wafers
    Luoto, Hannu
    Henttinen, Kimmo
    Suni, Tommi
    Dekker, James
    Makinen, Jan
    Torkkeli, Altti
    SOLID-STATE ELECTRONICS, 2007, 51 (02) : 328 - 332