Bond strength of bonded SOI wafers

被引:0
|
作者
机构
[1] Sugimoto, Fumitoshi
[2] Arimoto, Yoshihiro
来源
Sugimoto, Fumitoshi | 1600年 / 31期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] BOND STRENGTH OF BONDED SOI WAFERS
    SUGIMOTO, F
    ARIMOTO, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (04): : 975 - 978
  • [2] A Study on the Bond Strength of BCB-bonded Wafers
    Kwon, Yongchai
    Seok, Jongwon
    Lu, Jian-Qiang
    Cale, Timothy
    Gutmann, Ronald
    KOREAN CHEMICAL ENGINEERING RESEARCH, 2007, 45 (05): : 479 - 486
  • [3] A KINETICS STUDY OF THE BOND STRENGTH OF DIRECT-BONDED WAFERS
    FARRENS, SN
    HUNT, CE
    ROBERDS, BE
    SMITH, JK
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (11) : 3225 - 3230
  • [4] Recent developments on bonded SOI wafers
    Abe, T
    Katayama, M
    REPORT OF RESEARCH CENTER OF ION BEAM TECHNOLOGY HOSEI UNIVERSITY, SUPPLEMENT NO 14, MARCH 1996, 1996, : 7 - 15
  • [5] Quality Control of Bond Strength in Low-Temperature Bonded Wafers
    Siegert, J.
    Cassidy, C.
    Schrank, F.
    Gerbach, R.
    Boettge, B.
    Naumann, F.
    Petzold, M.
    SEMICONDUCTOR WAFER BONDING 12: SCIENCE, TECHNOLOGY, AND APPLICATIONS, 2012, 50 (07): : 253 - 262
  • [6] TOTAL DOSE HARDNESS OF BONDED SOI WAFERS
    MCKITTERICK, JB
    CAVIGLIA, A
    MASZARA, WP
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1992, 39 (06) : 2098 - 2102
  • [7] Oxidation induced crystalline defects in bonded SOI wafers
    Papakonstantinou, P
    Somasundram, K
    Cao, X
    Quinn, C
    Yallup, K
    Nevin, WA
    SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS V, PROCEEDINGS, 2001, 99 (35): : 178 - 186
  • [8] Automotive SOI-BCD Technology Using Bonded Wafers
    Himi, H.
    Fujino, S.
    ION IMPLANTATION TECHNOLOGY 2008, 2008, 1066 : 495 - 500
  • [9] Reduction of defects in thin bonded silicon on insulator (SOI) wafers
    Aga, H
    Mitani, K
    Kobayashi, N
    SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS IV, 1998, 36 : 552 - 558
  • [10] Bond strength tests between silicon wafers and duran tubes - (Fusion bonded fluidic interconnects)
    Fazal, I
    Berenschot, E
    deBoer, R
    Jansen, H
    Elwenspoek, M
    TRANSDUCERS '05, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2005, : 936 - 939