Hybrid WDM transmitter/receiver module using alignment free assembly techniques

被引：0
|
作者：
NEC Corp, Kanagawa, Japan [1 ]
机构：
来源：
IEEE Trans Compon Packag Manuf Technol Part B Adv Packag | / 2卷 / 140-146期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Skmer: assembly-free and alignment-free sample identification using genome skims
    Sarmashghi, Shahab
    Bohmann, Kristine
    Gilbert, M. Thomas P.
    Bafna, Vineet
    Mirarab, Siavash
    GENOME BIOLOGY, 2019, 20 (1)
  • [32] Transmitter-Receiver Optical Sub Assembly using Ultra-Compact Tunable DBR/Ring Laser
    Nagashima, Kazuya
    Ishikawa, Yozo
    Izawa, Atsushi
    Nishita, Masayoshi
    Matsubara, Noritaka
    Ishii, Hiroyuki
    Saeyang, Thanakit
    Ogiso, Yoshihiro
    Ueda, Yuta
    Kohtoku, Masaki
    2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), 2021,
  • [33] AN OPTICAL 90-DEGREES-HYBRID BALANCED RECEIVER MODULE USING A PLANAR LIGHTWAVE CIRCUIT
    NORIMATSU, S
    TAKACHIO, N
    INOUE, Y
    HOSOYA, M
    TSUNETSUGU, H
    HATA, S
    IEEE PHOTONICS TECHNOLOGY LETTERS, 1994, 6 (06) : 737 - 740
  • [34] Hybrid integrated Bi-directional Module using Polymeric WDM Filter Based on Multimode Interference
    Lim, Jung Woon
    Hwang, Sung Hwan
    Lee, Woo-Jin
    Lee, Tae Ho
    Jeong, Myung Yong
    Kim, Boo-Gyoun
    Rho, Byung Sup
    2009 14TH OPTOELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC 2009), 2009, : 348 - +
  • [35] 10-GB/S STRAINED MQW DFB-LD TRANSMITTER MODULE AND SUPERLATTICE APD RECEIVER MODULE USING GAAS-MESFET ICS
    MIYAMOTO, Y
    HAGIMOTO, K
    OHHATA, M
    KAGAWA, T
    TSUZUKI, N
    TSUNETSUGU, H
    NISHI, I
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 1994, 12 (02) : 332 - 342
  • [36] A 10 Gb/s hybrid-integrated receiver array module using a planar lightwave circuit (PLC) platform including a novel assembly region structure
    Mino, S
    Ohyama, T
    Akahori, Y
    Hashimoto, T
    Yamada, Y
    Yanagisawa, M
    Muramoto, Y
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 1996, 14 (11) : 2475 - 2482
  • [37] Fully automated hybrid diode laser assembly using high precision active alignment
    Boettger, Gunnar
    Weber, Daniel
    Scholz, Friedemann
    Schroeder, Henning
    Schneider-Ramelow, Martin
    Lang, Klaus-Dieter
    COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, 2016, 9730
  • [38] Reduction of Four-Wave Mixing Effect in WDM Systems Using Hybrid Modulation Techniques
    Dhivya, M.
    Rajini, Helina J.
    Selvi, Tamil S.
    2016 INTERNATIONAL CONFERENCE ON COMMUNICATION AND SIGNAL PROCESSING (ICCSP), VOL. 1, 2016, : 2180 - 2185
  • [39] 622 Mb/s/channel parallel digital optical receiver array module using hybrid packaging
    Siala, S
    Ramakrishnan, V
    Govindarajan, M
    Dekovic, Y
    Kinter, R
    Padilla, J
    Levi, AFJ
    Nottenburg, RN
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (03): : 548 - 553
  • [40] A small one-fiber WDM optical ether card using hybrid module technologies and its application
    Sugimoto, N
    Suzuki, Y
    Sakai, Y
    Toba, H
    Oguchi, K
    6TH WORLD MULTICONFERENCE ON SYSTEMICS, CYBERNETICS AND INFORMATICS, VOL X, PROCEEDINGS: MOBILE/WIRELESS COMPUTING AND COMMUNICATION SYSTEMS II, 2002, : 596 - 599
12345