共 50 条
- [22] Flux/underfill compatibility study for flip-chip manufacturing INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 37 - 41
- [23] Flux Challenges in Flip-Chip Die-Attach 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [24] Design of microwave hybrid-monolithic integrated circuits with the use of flip-chip technique 11TH INTERNATIONAL CONFERENCE MICROWAVE & TELECOMMUNICATION TECHNOLOGY, CONFERENCE PROCEEDINGS, 2001, : 128 - 129
- [26] FIB techniques to debug flip-chip integrated circuits Semiconductor International, 1998, 21 (03): : 111 - 112
- [28] A flip-chip LIGA assembly technique via electroplating Microsystem Technologies, 2001, 7 : 40 - 43
- [30] Flux/underfill Compatibility Study for Flip-chip Assembly Process INFORMATION AND ELECTRONICS ENGINEERING, 2011, 6 : 223 - 227