Study on the technology of high density gold-wire ball bonding under normal temperature

被引：0
|
作者：
机构：
来源：
Hongwai Jishu | / 3卷 / 33-35期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Study on the low-looped ability of forward and reverse looping methods of gold wire ball bonding for stacked die package application
    Cheng, Xiu-Lan
    Huang, Yu-Cai
    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 418 - +
  • [42] Investigation of Ultrasonic Platinum and Palladium Wire Bonding as Interconnection Technology for High-Temperature SiC-MEMS
    Zeiser, Roderich
    Wagner, Philipp
    Wilde, Juergen
    2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
  • [43] High Temperature Storage (HTS) performance of copper ball bonding wires
    Saraswati
    Theint, EPP
    Stephan, D
    Goh, HM
    Pasamanero, E
    Calpito, DRM
    Wulff, FW
    Breach, CD
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 602 - 607
  • [44] A hybrid approach for multi-objective design optimization of ball grid array gold wire bonding process
    Tzeng, Yih-Fong
    Chen, Fu-Chen
    Chen, Chih-Huang
    JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2015, 9 (02):
  • [45] Study on the failure of IGBT bonding wire based on temperature gradient
    Tu, Chunming
    Xu, Haoliang
    Xiao, Biao
    Long, Liu
    Chai, Ming
    IECON 2020: THE 46TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, 2020, : 3011 - 3016
  • [46] EFFECT OF BONDED BALL SHAPE ON GOLD WIRE BONDING QUALITY BASED ON ANSYS/LS-DYNA SIMULATION
    Huang, Weidong
    Wu, Wei
    Wu, Jacky
    Dong, Grass
    Oo, C. F.
    2020 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2020 (CSTIC 2020), 2020,
  • [47] Study of temperature parameter in Au-Ag wire bonding
    Long, Zhili
    Han, Lei
    Wu, Yunxin
    Zhong, Jue
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2008, 31 (03): : 221 - 226
  • [48] Bonding of gold wire to electrolytic and immersion gold-plated FR-4 laminates at low temperature
    Ho, HM
    Yeo, CK
    Chan, SL
    Wong, N
    Ng, CC
    Ramanujan, CS
    Li, K
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 190 - 195
  • [49] Bonding of gold wire to electrolytic and immersion gold-plated FR-4 laminates at low temperature
    Delphi Automotive Systems
    Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 190 - 195
  • [50] A study on wire ball/pad open failure mechanism of a multi-stack package (MSP) under high temperature storage (HTS) condition
    Yang, Se Young
    Byun, Hyeong-Jik
    Park, Sang-Wook
    Lee, Wang-Joo
    2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, : 113 - +
12345