Design of a visual system for predicting SMT solder joint shape

被引：0
|
作者：
Zhao, Xiujuan [1 ]
Wang, Chunqing [1 ]
Zheng, Guanqun [1 ]
Wang, Guozhong [1 ]
Yang, Shiqin [1 ]
机构：
[1] Harbin Inst of Technology, Harbin, China
来源：
China Welding (English Edition) | 1999年 / 8卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1 / 8
相关论文
共 50 条
  • [41] An exPerimental study of effect of solder joint geometry on thermal cycle life in SMT
    王国忠
    方鸿渊
    王春青
    钱乙余
    China Welding, 1997, (01) : 70 - 76
  • [42] Fatigue of SMT solder joint including torsional curvature and chip location optimization
    Guo, Q
    Zhao, M
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2005, 26 (7-8): : 887 - 895
  • [43] Finite element modeling of three-dimensional solder joint geometry in SMT
    Lee, TS
    Choi, TP
    Yoo, CD
    JOURNAL OF ELECTRONIC PACKAGING, 1997, 119 (02) : 119 - 126
  • [44] Fatigue of SMT solder joint including torsional curvature and chip location optimization
    Qiang Guo
    Mei Zhao
    The International Journal of Advanced Manufacturing Technology, 2005, 26 : 887 - 895
  • [45] A design tool for evaluating low cycle solder fatigue of SMT interconnections
    Carper, T
    Viswanadham, P
    Von Mayr, R
    DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 305 - 316
  • [46] Impact of solder pad shape on lead-free solder joint reliability
    Vasko, Cyril
    Novotny, Marek
    Szendiuch, Ivan
    2008 31ST INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: RELIABILITY AND LIFE-TIME PREDICTION, 2008, : 443 - 445
  • [47] Solder joint reliability with variations of solder ball land design
    Jung, Young Hy
    2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, : 389 - 409
  • [48] PERFORMANCE-RELATED SOLDER JOINT INSPECTION FOR SMT-BASED MULTILAYER ASSEMBLIES
    MILLARD, DL
    PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 643 - 651
  • [49] Methodology for predicting solder joint reliability in semiconductor packages
    Pendse, RD
    Zhou, P
    MICROELECTRONICS RELIABILITY, 2002, 42 (02) : 301 - 305
  • [50] Research on Visual Inspection Method and Instrument of Solder Joint
    Shi Wenjie
    Zuo Zhijiang
    Li Han
    Pan Libo
    IFAC PAPERSONLINE, 2022, 55 (03): : 131 - 136
12345