Analytical Characterization of Adhesives.

被引：0
|
作者：
Housh, Riitta [1 ]
机构：
[1] Valtion Teknillinen Tutkimuskeskus, Espoo, Finl, Valtion Teknillinen Tutkimuskeskus, Espoo, Finl
来源：
Kemia-Kemi/Finnish Chemical Journal | 1987年 / 14卷 / 10期
关键词：
CALORIMETRY - QUALITY CONTROL - SPECTROSCOPY; INFRARED;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The analytical characterization of adhesives is described with primary attention paid to the study of the cure of adhesive resins. Identification, quality control, and bond failure studies are briefly discussed. Differential scanning calorimetry is the most versatile method for curing studies. Gelation and hardening of all adhesive types can be monitored by dynamic-mechanical experiments. Torsional modulus and mechanical damping are related to molecular mobility, which becomes restricted as the cure proceeds. Dielectric methods are especially suitable for investigating adhesives for metal joints.
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页码：868 / 872
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