共 50 条
- [41] Thermomechatronics of power electronic packages ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL 2, PROCEEDINGS, 2000, : 270 - 278
- [42] Sinter Paste for Power Packages 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 458 - 462
- [43] Thermomechatronics of power electronic packages 2000, IEEE, Piscataway, NJ, United States (02):
- [45] ANTIMIXING FLOW FOR SMALL OUTLINE PACKAGES 2022 IEEE 39TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2022,