共 33 条
- [31] Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration Microsystem Technologies, 2023, 29 : 1651 - 1658
- [32] Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2023, 29 (11): : 1651 - 1658
- [33] Finite element analysis of dynamic drop impact of board-level stacked-die packages using submodeling technique 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 398 - 405