Potential failure sites in a flip-chip package with and without underfill

被引：0
|
作者：
Madenci, E. [1 ]
Shkarayev, S. [1 ]
Mahajan, R. [1 ]
机构：
[1] Univ of Arizona, Tucson, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1998年 / 120卷 / 04期
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页码：336 / 341
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