Adhesion measurement of thin metal films by scratch, peel, and pull methods

被引：0

作者：

Kinbara, Akira ^{[1
]}

Kondo, Ichiharu ^{[1
]}

机构：

[1] Univ of Tokyo, Tokyo, Japan

来源：

Journal of Adhesion Science and Technology | 1993年 / 7卷 / 8 pt 1期

关键词：

Auger electron spectroscopy - Correlation methods - Deposition - Heat treatment - Interfaces (materials) - Ion implantation - Metallic films - Strength of materials - Substrates - Surface testing - Thin films - Transmission electron microscopy;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Scratch, peel, and pull methods for adhesion measurement were applied to deposited thin film/solid substrate combinations. Scatter in the experimental data was observed and its origin is discussed. The interface between the thin film and the substrate was investigated by transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and Auger electron spectroscopy (AES), and the correlation of the interface structure with the adhesion strength was investigated. Ion bombardment and heat treatment were carried out to enhance the adhesion. Accumulation of bombarding gas ions at the interface was observed and the role of ion bombardment in improving adhesion is considered.

引用

页码：767 / 782

共 50 条

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