CONDUCTIVE EPOXY IS TESTED FOR SMT SOLDER REPLACEMENT.

被引：0

作者：

Pound, Ronald ^{[1
]}

机构：

[1] Electronic Packaging &, Production, Des Plaines, IL, USA, Electronic Packaging & Production, Des Plaines, IL, USA

来源：

Electronic Packaging and Production | 1985年 / 25卷 / 02期

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D O I：

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学科分类号：

摘要：

引用

页码：86 / 90

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