CALCULATION OF DIRECT COMBINED TRANSDUCERS OF ULTRASONIC FLAW INSPECTION DEVICES: II. CALCULATION OF DIRECT TRANSDUCERS.

被引:0
|
作者
Gitis, M.B. [1 ]
Shenker, A.A. [1 ]
机构
[1] S. Lazo Polytechnical Inst, Kishinev, USSR, S. Lazo Polytechnical Inst, Kishinev, USSR
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
ULTRASONIC TRANSDUCERS
引用
收藏
页码:381 / 388
相关论文
共 50 条
  • [41] CALCULATION AND PREPARATION OF SPLIT-COMBINED PROBES FOR ULTRASONIC INSPECTION OF LARGE PARTS
    LAPIN, YV
    ERMOLOV, IN
    KRAKOVYAK, MF
    SOVIET JOURNAL OF NONDESTRUCTIVE TESTING-USSR, 1980, 16 (03): : 165 - 171
  • [43] Direct calculation of the scattering amplitude without partial-wave analysis. II. Inclusion of exchange
    Shertzer, J
    Temkin, A
    PHYSICAL REVIEW A, 2004, 70 (04): : 042710 - 1
  • [44] Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology
    Zhao, Libo
    Li, Jie
    Li, Zhikang
    Zhang, Jiawang
    Zhao, Yihe
    Wang, Jiuhong
    Xia, Yong
    Li, Ping
    Zhao, Yulong
    Jiang, Zhuangde
    SENSORS AND ACTUATORS A-PHYSICAL, 2017, 264 : 63 - 75
  • [45] Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology
    Zhao L.
    Li J.
    Li Z.
    Zhang J.
    Zhao Y.
    Wang J.
    Xia Y.
    Li P.
    Zhao Y.
    Jiang Z.
    Zhao, Libo (libozhao@mail.xjtu.edu.cn), 1600, Elsevier B.V., Netherlands (264): : 63 - 75
  • [46] CALCULATION AND PREPARATION OF SPLIT-COMBINED PROBES FOR ULTRASONIC INSPECTION OF LARGE PARTS.
    Lapin, Yu.V.
    Ermolov, I.N.
    Krakovyak, M.F.
    The Soviet journal of nondestructive testing, 1980, 16 (03): : 165 - 171
  • [48] Additive Manufacturing (AM) Capacitive Acoustic and Ultrasonic Transducers Using a Commercial Direct Light Processing (DLP) Printer
    Zhu, Botong
    Guerreiro, Jose Manuel Francisco
    Zhang, Yansheng
    Tiller, Benjamin P.
    Windmill, James F. C.
    IEEE SENSORS JOURNAL, 2020, 20 (04) : 1770 - 1777
  • [49] Active Ultrasonic Structural Health Monitoring Enabled by Piezoelectric Direct-Write Transducers and Edge Computing Process
    Wong, Voon-Kean
    Rabeek, Sarbudeen Mohamed
    Lai, Szu Cheng
    Philibert, Marilyne
    Lim, David Boon Kiang
    Chen, Shuting
    Raja, Muthusamy Kumarasamy
    Yao, Kui
    SENSORS, 2022, 22 (15)
  • [50] CALCULATION OF STRUCTURAL NOISE-LEVEL DURING ULTRASONIC INSPECTION WITH A SEPARATE-COMBINED TRANSDUCER
    MOROZOV, KI
    PYANKOV, VA
    SOVIET JOURNAL OF NONDESTRUCTIVE TESTING-USSR, 1989, 25 (02): : 148 - 155