ACID COPPER BATH FOR THROUGH-HOLE PLATING.

被引：0
|
作者：
Bindra, P.
David, A.
Galasco, R.
Light, D.N.
Varsik, J.
York, E.
机构：
来源：
IBM technical disclosure bulletin | 1983年 / 26卷 / 04期
关键词：
COPPER PLATING;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This acid copper bath has a high throwing power suitable for through-hole plating in printed circuit boards. The acid copper plating bath contains copper sulfate, free sulfuric acid, chloride ions and an organic additive of the polyglycol family with a molecular weight greater than 600 g/mole.
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页码：2173 / 2176
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