Micro-assembly of microelectromechanical components into 3-D MEMS

被引:0
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作者
Dechev, Nikolai [1 ]
Cleghorn, William L. [1 ]
Mills, James K. [1 ]
机构
[1] Dept. of Mechanical and Indust. Eng., University of Toronto, 5 King's College Road, Toronto, Ont. M5S 3G8, Canada
关键词
CMOS integrated circuits - Computer simulation - Degrees of freedom (mechanics) - Grippers - Interfaces (computer) - Manipulators - Robotic arms - Robotic assembly - Silicon wafers - Three dimensional;
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摘要
This work describes a proposed micro-assembly process for combining planar microcomponents, 60 to 200 μm in size, into three-dimensional (3-D) microelectromechanical systems (MEMS). The microcomponents and microgrippers proposed are to be fabricated using multi-user MEMS processes (MUMPS). Currently, micro-assembly research can be classified into two main areas. One area involves batch or parallel micro-assembly, while the other area involves sequential robotic micro-assembly. This work proposes the use of sequential robotic manipulations for the micro-assembly of MEMS. The micro-assembly process can be divided into three major steps: (1) attaching a MEMS microgripper to a large five-axis manipulator, (2) grasping microcomponents with the MEMS microgripper, and (3) joining the microcomponents together using self-locking (snap-lock) geometrical features. This three-step micro-assembly process should create 3-D MEMS devices that cannot be constructed with current techniques.
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页码:7 / 15
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