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- [21] Solutions to the needs for higher interconnect density on PWB's: Build up technology and Micro vias 1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS, 1999, 3830 : 204 - 209
- [24] Fine-pitch Solder Joining for High Density Interconnection 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 600 - 603
- [26] High Reliability Solder Resist with Strong Adhesion and High Resolution for High Density Packaging 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1015 - 1021
- [27] Solder Bead on High Density Interconnect Printed Circuit Board 2008 IEEE INTERNATIONAL TEST CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 393 - 397
- [28] Damage mechanics of solder joints under high current density Mechanical Behavior of Materials X, Pts 1and 2, 2007, 345-346 : 1403 - 1410
- [29] Ultra-fine photoresist image formation for next generation high-density PWB substrate 2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, 2000, 4217 : 467 - 472
- [30] The application of super-RENS mask in high density mastering ADVANCES IN OPTICAL DATA STORAGE TECHNOLOGY, 2005, 5643 : 165 - 170