共 50 条
- [31] Influence of No-Clean Flux on The Corrosivity of Copper After Reflow 2022 45TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2022,
- [34] Investigation of the Effect of Temperature on the Properties of No-Clean Reflow Soldering Fluxes Journal of Electronic Materials, 2020, 49 : 6727 - 6736
- [36] Issues that impact the conversion to a no-clean surface mount assembly process Comput Ind Eng, 1-2 (57-60):
- [37] How to reduce ICT 'false' failures in a no-clean flux environment SMT Surf Mount Technol Mag, 4 (62, 64, 66):
- [38] Epoxy flux - An answer for reliable no-clean flip chip assembly IEEE/CPMT/SEMI(R) 28TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 2003, : 409 - 415
- [39] The Effect of Clean and No-clean Flux in Enhancing the Wettability of Eutectic Solder Bump Flip Chip PBGA ICSE: 2008 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS, 2008, : 388 - +