共 50 条
- [32] Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive ADVANCES IN CIVIL INFRASTRUCTURE ENGINEERING, PTS 1 AND 2, 2013, 639-640 : 354 - 358
- [34] Curing effects on viscosity and mechanical properties of a commercial epoxy resin adhesive Lapique, F. (fabrice.lapique@sintef.no), 1600, Elsevier Ltd (22):
- [36] Basic analytical control techniques for epoxy resins and adhesive curing agents Polymer Science Series C, 2007, 49 : 95 - 98
- [40] Study on the Curing Kinetics and Curing Behavior of Epoxy Conductive Adhesive Materials for Electronic Packaging and Their Impact on Conductivity 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,