Effects of curing accelerators on physical properties of epoxy molding compound (EMC)

被引:0
|
作者
机构
[1] Ogata, Masatsugu
[2] Kinjo, Noriyuki
[3] Eguchi, Shuji
[4] Hozoji, Hiroshi
[5] Kawata, Tatsuo
[6] Sashima, Hiroki
来源
Ogata, Masatsugu | 1795年 / 44期
关键词
Epoxy Resins;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] EFFECTS OF CURING ACCELERATORS ON PHYSICAL-PROPERTIES OF EPOXY MOLDING COMPOUND (EMC)
    OGATA, M
    KINJO, N
    EGUCHI, S
    HOZOJI, H
    KAWATA, T
    SASHIMA, H
    JOURNAL OF APPLIED POLYMER SCIENCE, 1992, 44 (10) : 1795 - 1805
  • [2] Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators
    Yu, Yongjia
    Yang, Xin
    Liu, Qianfa
    She, Naidong
    Liu, Dongliang
    Huang, Wei
    POLYMERS FOR ADVANCED TECHNOLOGIES, 2022, 33 (09) : 2908 - 2920
  • [3] Characterization of the rheological properties of a fast-curing epoxy-molding compound
    Han, SJ
    Wang, KK
    Hieber, CA
    Cohen, C
    JOURNAL OF RHEOLOGY, 1997, 41 (02) : 177 - 195
  • [4] The physical properties of EMC(epoxy molding compounds) reinforced with ALN(aluminum nitride)
    Kim, W
    Bae, J
    ANTEC'97 - PLASTICS SAVING PLANET EARTH, CONFERENCE PROCEEDINGS, VOLS 1 - 3, 1997, : 1438 - 1442
  • [5] Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
    Kim, W
    Bae, JW
    Choi, ID
    Kim, YS
    POLYMER ENGINEERING AND SCIENCE, 1999, 39 (04): : 756 - 766
  • [6] LATEST TECHNOLOGIES OF EPOXY MOLDING COMPOUND (EMC) FOR FO-WLP
    Mori, Takeshi
    2019 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC), 2019,
  • [7] Effects of polymer networks on physical properties of epoxy molding compounds
    Eguchi, S
    Nagai, A
    Ishii, T
    Nishi, K
    Sashima, H
    Ogata, M
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1996, 211 : 223 - POLY
  • [8] Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing
    Lin, Yeong-Jyh
    Hwang, Sheng-Jye
    Lee, Huei-Huang
    Huang, Durn-Yuan
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (11): : 1755 - 1760
  • [9] A low-viscousity, highly thermally conductive epoxy molding compound (EMC)
    Jong-Woo Bae
    Wonho Kim
    Seungchul Hwang
    Young-Sun Choe
    Sang-Hyun Lee
    Macromolecular Research, 2004, 12 : 78 - 84
  • [10] A low-viscousity, highly thermally conductive epoxy molding compound (EMC)
    Bae, JW
    Kim, W
    Hwang, S
    Choe, YS
    Lee, SH
    MACROMOLECULAR RESEARCH, 2004, 12 (01) : 78 - 84