Nanotopography Impact and Non-Prestonian Behavior of Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Polishing (STI-CMP)

被引：0
|
作者：
Katoh, Takeo [1 ]
Kim, Min-Seok [1 ]
Paik, Ungyu [2 ]
Park, Jea-Gun [1 ]
机构：
[1] Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea, Republic of
[2] Department of Ceramic Engineering, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea, Republic of
来源：
Japanese Journal of Applied Physics, Part 2: Letters | 2004年 / 43卷 / 2 A期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Nanotopography impact and non-prestonian Behavior of ceria slurry in shallow trench isolation chemical mechanical polishing (STI-CMP)
    Katoh, T
    Kim, MS
    Paik, U
    Park, JG
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (2A): : L217 - L220
  • [2] Non-Prestonian Behavior of Rectangular Shaped Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization
    Kim, Ye-Hwan
    Jung, Yeon-Gil
    Yoon, Gwang Seob
    Moon, Jinok
    Watanabe, Akira
    Naito, Makio
    Paik, Ungyu
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2012, 12 (03) : 2810 - 2814
  • [3] Effects of abrasive size and surfactant concentration on the non-Prestonian behavior of ceria slurry in shallow trench isolation chemical mechanical polishing
    Kang, Hyun-Goo
    Katoh, Takeo
    Park, Hyung-Soon
    Pair, Ungyu
    Park, Jea-Gun
    Japanese Journal of Applied Physics, Part 2: Letters, 2005, 44 (1-7):
  • [4] Effects of abrasive size and surfactant concentration on the non-prestonian behavior of ceria slurry in shallow trench isolation chemical mechanical polishing
    Kang, HG
    Katoh, T
    Park, HS
    Paik, U
    Park, JG
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2005, 44 (1-7): : L136 - L139
  • [5] Dependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing
    Kang, Hyun-Goo
    Kim, Dae-Hyeong
    Katoh, Takeo
    Kim, Sung-Jun
    Paik, Ungyu
    Park, Jea-Gun
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (5A): : 3896 - 3904
  • [6] Dependence of Nanotopography Impact on Abrasive Size and Surfactant Concentration in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
    Kang, Hyun-Goo
    Katoh, Takeo
    Lee, Won-Mo
    Paik, Ungyu
    Park, Jea-Gun
    Japanese Journal of Applied Physics, Part 2: Letters, 2004, 43 (1 A/B):
  • [7] Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
    Cho, Kyu-Chul
    Jeon, Hyeongtag
    Park, Jea-Gun
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2006, 16 (05): : 308 - 311
  • [8] Dependence of nanotopography impact on abrasive size and surfactant concentration in ceria slurry for shallow trench isolation chemical mechanical polishing
    Kang, HG
    Katoh, T
    Lee, WM
    Paik, U
    Park, JG
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (1A-B): : L1 - L4
  • [9] Nanotopography impact in shallow trench isolation chemical mechanical polishing-dependence on slurry characteristics
    Park, JG
    Katoh, T
    Paik, U
    JOURNAL OF RARE EARTHS, 2004, 22 : 1 - 4
  • [10] Effect of molecular weight of surfactant in nano ceria slurry on shallow trench isolation chemical mechanical polishing (CMP)
    Kang, H.-G. (ceramist@ihanyang.ac.kr), 1600, Japan Society of Applied Physics (43):
12345