Evaluating wafer inspection and cleaning with standard particles

被引：0

作者：

Liu, Benjamin Y.H. ^{[1
,5
,6
]}

Yoo, Seong-Ho ^{[1
,7
]}

Chae, Seung-Ki ^{[1
,2
,8
,9
]}

Sun, James J. ^{[3
,10
,11
]}

Christenson, Kurt ^{[4
,12
,13
]}

Butterbaugh, Jeffery ^{[1
,4
,14
]}

Weygand, James F. ^{[1
,4
,15
]}

Narayanswami, Natraj ^{[4
,16
,17
]}

机构：

[1] University of Minnesota

[2] Samsung Electronics, Korea, Republic of

[3] MSP Corp.

[4] FSI International

[5] Department of Mechanical Engineering, University of Minnesota

[6] National Academy of Engineering

[7] Korea University

[8] Seoul National University

[9] Semiconduct. Mfg. Technology Center, Korea, Republic of

[10] Semiconduct. and Indust. Prod. Group, MSP Corp.

[11] Zhejiang University, China

[12] Bethel College, St. Paul, MN, United States

[13] University of Illinois, Urbana, IL, United States

[14] Massachusetts Inst. of Technology

[15] Polytechnic Institute of Brooklyn

[16] Institute of Technology, Banaras Hindu University, India

[17] Rutgers University

来源：

Semiconductor International | 2000年 / 23卷 / 06期

关键词：

Cleaning - Contamination - Copper - Deposition - Inspection - Latexes - Particle size analysis - Polystyrenes - Refractive index - Semiconducting silicon compounds - Silica - Silicon wafers;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

To study the response of a wafer surface scanner and perform cleaning system evaluation, a process particle deposition system was used to deposit polystyrene latex (PSL) spheres and real-world process particles of Si, SiO2, W and Cu on wafers. It was found that the scanner response is affected by the particle refractive index. The measured cleaning efficiency was found to be dependent on particle material.

引用

页码：145 / 146

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