Evaluating wafer inspection and cleaning with standard particles

被引：0
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作者：
Liu, Benjamin Y.H. [1 ,5 ,6 ]
Yoo, Seong-Ho [1 ,7 ]
Chae, Seung-Ki [1 ,2 ,8 ,9 ]
Sun, James J. [3 ,10 ,11 ]
Christenson, Kurt [4 ,12 ,13 ]
Butterbaugh, Jeffery [1 ,4 ,14 ]
Weygand, James F. [1 ,4 ,15 ]
Narayanswami, Natraj [4 ,16 ,17 ]
机构：
[1] University of Minnesota
[2] Samsung Electronics, Korea, Republic of
[3] MSP Corp.
[4] FSI International
[5] Department of Mechanical Engineering, University of Minnesota
[6] National Academy of Engineering
[7] Korea University
[8] Seoul National University
[9] Semiconduct. Mfg. Technology Center, Korea, Republic of
[10] Semiconduct. and Indust. Prod. Group, MSP Corp.
[11] Zhejiang University, China
[12] Bethel College, St. Paul, MN, United States
[13] University of Illinois, Urbana, IL, United States
[14] Massachusetts Inst. of Technology
[15] Polytechnic Institute of Brooklyn
[16] Institute of Technology, Banaras Hindu University, India
[17] Rutgers University
来源：
Semiconductor International | 2000年 / 23卷 / 06期
关键词：
Cleaning - Contamination - Copper - Deposition - Inspection - Latexes - Particle size analysis - Polystyrenes - Refractive index - Semiconducting silicon compounds - Silica - Silicon wafers;
D O I：
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中图分类号：
学科分类号：
摘要：
To study the response of a wafer surface scanner and perform cleaning system evaluation, a process particle deposition system was used to deposit polystyrene latex (PSL) spheres and real-world process particles of Si, SiO2, W and Cu on wafers. It was found that the scanner response is affected by the particle refractive index. The measured cleaning efficiency was found to be dependent on particle material.
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页码：145 / 146
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