HOT-PLATE ALLOYING FOR OHMIC CONTACTS TO GaAs.

被引：0
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作者：
Henry, H.George [1 ]
Dawson, Dale E. [1 ]
Lemnios, Zachary J. [1 ]
Kim, Hebong [1 ]
机构：
[1] Westinghouse ATD, Baltimore, MD, USA, Westinghouse ATD, Baltimore, MD, USA
来源：
IEEE Transactions on Electron Devices | 1984年 / ED-31卷 / 08期
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摘要：
9
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页码：1100 / 1103
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